As gold prices climb, the semiconductor industry is shifting to copper for die-to-package wire bonds. Copper Wire Bonding by Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong and Michael G. Pecht delivers a detailed, practical guide to every step of the Cu-bond journey—from process optimization to pad metallurgy and rigorous reliability testing .
Table of Contents
Book at a Glance
| Title | Copper Wire Bonding |
| Authors | Preeti S. Chauhan; Anupam Choubey; ZhaoWei Zhong; Michael G. Pecht |
| Publisher / Year | Springer New York • 2014 (Softcover reprint Aug 2016) |
| Formats | Hardcover, Softcover & eBook |
| Length | XXVI + 235 pp. |
| ISBNs | HC 978-1461457602; SC 978-1493953493; eBook 978-1461457619 |
| Price | eBook US $109.00; Softcover US $139.99 |
| Audience | Packaging & reliability engineers; process specialists; graduate students |
Why Copper Wire Bonding Still Matters
- Cost-driven migration – With gold increasingly cost-prohibitive, copper wire bonding presents both opportunity and challenge; this book demystifies the transition .
- End-to-end coverage – From bond-force and electric-flame-off optimization to ultrasonic energy tuning and equipment changes for first and second bonds .
- Metallurgical depth – Detailed discussion of Al–Cu intermetallic growth, bare vs. Pd-coated wire, and pad-finish interactions that dictate bond quality .
- Reliability focus – Dedicated chapters on thermal ageing, humidity testing and electromigration protocols ensure long-term field performance .
Chapter Highlights
| Chapter | Topic | Key Take-Away |
|---|---|---|
| 2 | Copper Wire Bonding (Intro) | Industry drivers & material-cost rationale |
| 3 | Bonding Process | Optimize bond force, EFO, current & ultrasonic energy |
| 4 | Bonding Metallurgies | Control intermetallic layer growth for reliability |
| 5 | Wire Bond Evaluation | Mechanical pull/shear tests and electrical checks |
| 6 | Thermal Reliability Tests | High-temperature ageing and failure analysis |
| 7 | Humidity & Electromigration | Moisture ingress and current-driven degradation |
| 8 | Wire Bond Pads | Compare bare Al vs. NiPd/Au pad finishes |
| 9 | Concerns & Solutions | Common failure modes and mitigation strategies |
| 10 | Recommendations | Best-practice guidelines for production rollout |
Key Strengths
- Authoritative team – Contributions from CALCE and industry consultants blend cutting-edge research with shop-floor wisdom .
- Practical orientation – Every chapter ends with clear, actionable recommendations rather than abstract theory.
- Visual clarity – 120 figures and tables illustrate processes, failure modes and equipment setups for rapid comprehension .
- Reliability emphasis – In-depth coverage of qualification tests helps avoid costly in-field bond failures.
Limitations
| Limitation | Impact | Work-around |
|---|---|---|
| Content based on 2013–14 tech | Omits latest alloy and pad innovations | Supplement with vendor app-notes on newest materials |
| High print price | Softcover lists at US $139.99 | Opt for the US $109.00 eBook edition |
| Narrow focus | Covers only copper wire bonding | Pair with broader packaging texts for alternative interconnects |
Who Should Read Copper Wire Bonding
| Reader | Benefit |
|---|---|
| Packaging engineers | Master the switch from Au to Cu bonds |
| Process engineers | Optimize bond-machine parameters for yield |
| Reliability specialists | Design and interpret aggressive qualification tests |
| Graduate students | Gain a deep understanding of copper interconnect science |
FAQ
Q: What major processes are covered?
A: Bond-force tuning, electric-flame-off settings, ultrasonic energy optimization and equipment adaptations for first/second bonds.
Q: Are pad-metallurgy interactions detailed?
A: Yes—bare Al, NiPd/Au and other pad finishes are compared with respect to intermetallic growth and bond integrity .
Q: Does it include reliability testing protocols?
A: Dedicated chapters outline thermal, humidity and electromigration tests, complete with pass/fail criteria .
Q: In which formats is the book available?
A: Hardcover, softcover reprint and eBook (EPUB/PDF) editions are offered by Springer
